Angebote zu "Compliant" (7 Treffer)

Kategorien

Shops

Stapelbares Schuhregal für bis zu 6 Paar Schuhe
37,99 € *
ggf. zzgl. Versand

Features: The 3-Tier 6 Pair Stackable Shoe Rack is made of solid pine wood shelf. Unique structure open display rack, shelves provide easy storage and display for decorative and home living accessories. Suitable for rooms needing vertical storage area. Designed to meet the demand of low cost but durable and efficient furniture. Made from 100-Percent imported pine wood with the high durability and without harsh chemicals. Thus there is no foul smell. Closer to healthy living and nature. A simple attitude towards lifestyle is reflected directly on the design, creating a trend of simply nature. Simple stylish design yet functional and suitable for any room Product Type: Shoe Rack Primary Material: Solid Wood Primary Material Details: Solid pine wood with environmentally friendly lacquer Finish: Espresso Wood Species: Pine Wood Tone: Dark Brown Wood Cabinets Included: No Mount Type: Freestanding Pairs of Shoes Capacity: 6 Shelves Included: Yes Number of Shelves: 2 Adjustable Shelves: No Drawers Included: No Number of Drawers: Soft Close or Self Close Drawer Glides: Closed Back: No Stackable: Yes Rotating: No Wall Mount Included: No Compatible Wall Mount Part Number: Bins Included: No Compatible Fabric Bin Part Number: Product Care: Wipe clean with a clean damp cloth. Avoid using harsh chemicals Style: Modern & Contemporary Country of Origin: China Spefications: Certifications: No GREENGUARD Certified: CSA Certified: PEFC Certified: Commercial OR Residential Certifications: No SFI Certified: FSC Certified: EPP Compliant: CPSIA Compliant: FISP Certified: No California Proposition 65 Warning Required: No General Certificate of Conformity (GCC): ISTA 3A or 6A Certified: Composite Wood Product (CWP): No CARB Phase II Compliant (formaldehyde emissions): TSCA Title VI Compliant (formaldehyde emissions): Dimensions: Overall Height - Top to Bottom: 44.5 Overall Width - Side to Side: 59.94 Overall Depth - Front to Back: 27.94 Overall Product Weight: 3 Drawers: No Drawer Height - Top to Bottom: Drawer Width - Side to Side: Drawer Depth - Front to Back: Shelves: Yes Shelf Width - Side to Side: 60 Shelf Depth - Front to Back: 28 Individual Shoe Cubby Holes: Yes Shoe Compartment Height - Top to Bottom: 15 Assembly: Assembly Required: Yes Tools Needed for Assembly: No tools required Avoid Power Tools:

Anbieter: moebel.de
Stand: 09.12.2019
Zum Angebot
GLS27SF010-70 - NOR-Flash 1Mbit (128K x 8), Par...
1,55 € *
zzgl. 5,95 € Versand

PRODUCT DESCRIPTIONThe GLS27SF512/010/020 are a 64K x8 / 128K x8 / 256Kx8 CMOS, many-Time Programmable (MTP) low cost flash, manufactured with high performance SuperFlash technology. The split-gate cell design and thick oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. These MTP devices can be electrically erased and programmed at least 1000 times using an external programmer with a 12V power supply. They have to be erased prior to programming. Thesedevices conform to JEDEC standard pinouts for byte-widememories. Featuring high-performance Byte-Program, theGLS27SF512/010/020 provide a Byte-Program time of 20ìs. Designed, manufactured, and tested for a wide spectrumof applications, these devices are offered with an endurance of at least 1000 cycles. Data retention is rated at greater than 100 years.FEATURES:• Organized as 64K x8 / 128K x8 / 256K x8• 4.5-5.5V Read Operation• Superior Reliability– Endurance: At least 1000 Cycles– Greater than 100 years Data Retention• Low Power Consumption– Active Current: 20 mA (typical)– Standby Current: 10 ìA (typical)• Fast Read Access Time– 70 ns• Fast Byte-Program Operation– Byte-Program Time: 20 ìs (typical)– Chip Program Time:1.4 seconds (typical) for GLS27SF5122.8 seconds (typical) for GLS27SF0105.6 seconds (typical) for GLS27SF020• Electrical Erase Using Programmer– Does not require UV source– Chip-Erase Time: 100 ms (typical)• TTL I/O Compatibility• JEDEC Standard Byte-wide EPROM Pinouts• Packages Available– 32-lead PLCC– 32-lead TSOP (8mm x 14mm)– 32-pin PDIP for GLS27SF010/020• All non-Pb (lead-free) devices are RoHS compliant

Anbieter: reichelt elektronik
Stand: 09.12.2019
Zum Angebot
GLS27SF020-70 - NOR-Flash 2Mbit (256K x 8), Par...
1,55 € *
zzgl. 5,95 € Versand

PRODUCT DESCRIPTIONThe GLS27SF512/010/020 are a 64K x8 / 128K x8 / 256Kx8 CMOS, many-Time Programmable (MTP) low cost flash, manufactured with high performance SuperFlash technology. The split-gate cell design and thick oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. These MTP devices can be electrically erased and programmed at least 1000 times using an external programmer with a 12V power supply. They have to be erased prior to programming. Thesedevices conform to JEDEC standard pinouts for byte-widememories. Featuring high-performance Byte-Program, theGLS27SF512/010/020 provide a Byte-Program time of 20ìs. Designed, manufactured, and tested for a wide spectrumof applications, these devices are offered with an endurance of at least 1000 cycles. Data retention is rated at greater than 100 years.FEATURES:• Organized as 64K x8 / 128K x8 / 256K x8• 4.5-5.5V Read Operation• Superior Reliability– Endurance: At least 1000 Cycles– Greater than 100 years Data Retention• Low Power Consumption– Active Current: 20 mA (typical)– Standby Current: 10 ìA (typical)• Fast Read Access Time– 70 ns• Fast Byte-Program Operation– Byte-Program Time: 20 ìs (typical)– Chip Program Time:1.4 seconds (typical) for GLS27SF5122.8 seconds (typical) for GLS27SF0105.6 seconds (typical) for GLS27SF020• Electrical Erase Using Programmer– Does not require UV source– Chip-Erase Time: 100 ms (typical)• TTL I/O Compatibility• JEDEC Standard Byte-wide EPROM Pinouts• Packages Available– 32-lead PLCC– 32-lead TSOP (8mm x 14mm)– 32-pin PDIP for GLS27SF010/020• All non-Pb (lead-free) devices are RoHS compliant

Anbieter: reichelt elektronik
Stand: 09.12.2019
Zum Angebot
GLS27SF512-70 - NOR-Flash 512Kbit (64K x 8), Pa...
1,35 € *
zzgl. 5,95 € Versand

PRODUCT DESCRIPTIONThe GLS27SF512/010/020 are a 64K x8 / 128K x8 / 256Kx8 CMOS, many-Time Programmable (MTP) low cost flash, manufactured with high performance SuperFlash technology. The split-gate cell design and thick oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. These MTP devices can be electrically erased and programmed at least 1000 times using an external programmer with a 12V power supply. They have to be erased prior to programming. Thesedevices conform to JEDEC standard pinouts for byte-widememories. Featuring high-performance Byte-Program, theGLS27SF512/010/020 provide a Byte-Program time of 20ìs. Designed, manufactured, and tested for a wide spectrumof applications, these devices are offered with an endurance of at least 1000 cycles. Data retention is rated at greater than 100 years.FEATURES:• Organized as 64K x8 / 128K x8 / 256K x8• 4.5-5.5V Read Operation• Superior Reliability– Endurance: At least 1000 Cycles– Greater than 100 years Data Retention• Low Power Consumption– Active Current: 20 mA (typical)– Standby Current: 10 ìA (typical)• Fast Read Access Time– 70 ns• Fast Byte-Program Operation– Byte-Program Time: 20 ìs (typical)– Chip Program Time:1.4 seconds (typical) for GLS27SF5122.8 seconds (typical) for GLS27SF0105.6 seconds (typical) for GLS27SF020• Electrical Erase Using Programmer– Does not require UV source– Chip-Erase Time: 100 ms (typical)• TTL I/O Compatibility• JEDEC Standard Byte-wide EPROM Pinouts• Packages Available– 32-lead PLCC– 32-lead TSOP (8mm x 14mm)– 32-pin PDIP for GLS27SF010/020• All non-Pb (lead-free) devices are RoHS compliant

Anbieter: reichelt elektronik
Stand: 09.12.2019
Zum Angebot
Analog-Baseband Architectures and Circuits for ...
204,00 CHF *
ggf. zzgl. Versand

The prospect of initializing a network-ubiquitous society in the years to come has led to the development of multistandard-compliant wireless transceivers for seamless roaming among multiple networks. To ensure a commercial success of such a development, the manufacturing cost and power consumption of the system chips have to be minimized. The use of an advanced technology and a high level of integration have continued to be the most effective ways for cost and power minimization, given that wireless chips integrate large amounts of digital logic for computation. Regrettably, entering into the nanoelectronics era, the thinner transistor gate oxide implicates great challenges in the design of the analog front-ends. While a low-voltage supply is imposed to maintain device reliability, a relatively large threshold voltage is also necessitated to limit the leakage current. Thus, transceiver architectures and circuits which will befit future full integration of multistandard wireless transceivers in sub-1V nanoscale CMOS processes must be highly reconfigurable and robustly operational underneath a l- voltage supply. This book presents novel analog-baseband architectures and circuits that help realizing multistandard and low-voltage wireless transceivers. The main contents are presented from Chapter 2 to Chapter 6, as pictorially outlined in Figure 1. Chapter 1 overviews the current wireless-IC developments and presents the motivation and research objectives of this book. xi xii Preface Figure 1.

Anbieter: Orell Fuessli CH
Stand: 09.12.2019
Zum Angebot
Analog-Baseband Architectures and Circuits for ...
207,99 € *
ggf. zzgl. Versand

The prospect of initializing a network-ubiquitous society in the years to come has led to the development of multistandard-compliant wireless transceivers for seamless roaming among multiple networks. To ensure a commercial success of such a development, the manufacturing cost and power consumption of the system chips have to be minimized. The use of an advanced technology and a high level of integration have continued to be the most effective ways for cost and power minimization, given that wireless chips integrate large amounts of digital logic for computation. Regrettably, entering into the nanoelectronics era, the thinner transistor gate oxide implicates great challenges in the design of the analog front-ends. While a low-voltage supply is imposed to maintain device reliability, a relatively large threshold voltage is also necessitated to limit the leakage current. Thus, transceiver architectures and circuits which will befit future full integration of multistandard wireless transceivers in sub-1V nanoscale CMOS processes must be highly reconfigurable and robustly operational underneath a l- voltage supply. This book presents novel analog-baseband architectures and circuits that help realizing multistandard and low-voltage wireless transceivers. The main contents are presented from Chapter 2 to Chapter 6, as pictorially outlined in Figure 1. Chapter 1 overviews the current wireless-IC developments and presents the motivation and research objectives of this book. xi xii Preface Figure 1.

Anbieter: Thalia AT
Stand: 09.12.2019
Zum Angebot